Iei-integration ICE-DB-T6 User Manual Page 88
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Type 6 Carrier Board Design Guide
Page 78
Figure 5-5: Compact, Basic and Extended Form Factor
5.5 Heat Spread
One of the important factors for the system integration is the thermal design. The
heatspreader, usually a 3mm thick aluminum plate, acts as a thermal coupling device to
the Module. The heatspreader is thermally coupled to the CPU via a thermal gap filler and
on some Modules it may also be thermally coupled to other heat generating components
with the use of additional thermal gap fillers. Although the heatspreader is the thermal
interface where most of the heat generated by the Module is dissipated, it is not to be
considered as a heat sink. It has been designed to be used as a thermal interface
between the Module and the application specific thermal solution.
Modules should be equipped with a heatspreader. The overall module height from the
bottom surface of the module board to the heatspreader top surface shall be 13 mm for
both the Basic and Extended Modules. A 2-mm PCB with a 3-mm heatspreader may be
used which allows use of readily available standoffs.
- COM Express Type 6 Module 1
- Carrier Board Design Guide 1
- Revision 2
- Copyright 3
- Table of Contents 4
- List of Figures 8
- List of Tables 10
- 1 Introduction 11
- 1.1 Introduction 12
- 2 Pin Assignments 20
- 2.1 Chapter Overview 21
- 2.3 Signal Table Terminology 23
- Page 14 24
- 3 Signal Description and 29
- Routing Guideline 29
- Page 20 30
- 3.1.1 Signal Description 30
- AC Coupling Cap 36
- 3.2 PCI Express 37
- Page 28 38
- 3.2.1 Signal Description 38
- Page 36 46
- 3.4.1 Signal Description 46
- from Semtech 51
- 3.5 DDI 53
- Page 44 54
- 3.6 LVDS 57
- 3.3V(Default) 59
- J_VLVDS1 59
- 3.7.1 Signal Description 61
- 3.8 Reference Circuit 62
- 3.9 LAN (Local Area Network) 63
- Page 58 68
- 3.10.2.1 Keyboard/Mouse 68
- 3.11 VGA 69
- 3.12 Miscellaneous 72
- CLEAR CMOS/Super CAP 74
- 4 PCB Stack and 76
- Power Deliver Design 76
- 4.1 Chapter Overview 77
- 4.2 Microstrip or Stripline 77
- 4.3 PCB Stackup Example 77
- Page 70 80
- Page 72 82
- 4.4.2 ATX Power Diagram 82
- Chapter 83
- 5.1 Chapter Overview 84
- 5.3 Connector Footprint 86
- • 0.8mm +0.075/-0.025mm 87
- • 1.5mm +0.075/-0.025mm 87
- 5.5 Heat Spread 88
- Page 80 90
- 5.6 Design Notes 91
- A Terminology 94
- Page 86 96
- B Application Notes 97
- B.1 Terminology 98
- B.2 Updating BIOS Version 98
- Page 90 100
- Page 92 102
- B.2.2 Using DOS Command 102
- B.3 RTC Overview 104
- C Reference Documents 105
- Page 96 106
- D Reference Carrier 107
- Board Schematic 107
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